Question 1

What is wafer coring?

Accepted Answer

Wafer coring is the process of cutting a smaller-diameter wafer from a larger one, or cutting a specific geometry from a wafer. It is used to resize wafers for compatibility with different process tools or research equipment.

Question 2

What wafer sizes can you core?

Accepted Answer

Dynamic Process Group cores wafers from 25.4mm (1 inch) up to 450mm (18 inch) in diameter.

Question 3

What materials can be wafer cored?

Accepted Answer

We core silicon, SOI (silicon-on-insulator), GaAs, SiC, InP, germanium, sapphire, and other compound semiconductor wafers.

Question 4

What technology do you use for wafer coring?

Accepted Answer

We use Synova Laser MicroJet technology, which uses a laser guided by a water jet for cold, clean, precise cuts with no thermal damage, no micro-cracks, and no contamination.

Question 5

Who offers laser dicing services in the United States?

Accepted Answer

Dynamic Process Group, Inc. provides laser dicing services from San Jose, California, using Synova Laser MicroJet water jet-guided laser technology to singulate silicon, SiC, GaAs and InP wafers without chipping or heat-affected zones.

Question 6

What is the difference between laser dicing and saw dicing?

Accepted Answer

Saw dicing uses a contact diamond blade that can chip die edges and requires wider streets. Laser dicing is non-contact, and water jet-guided laser dicing adds continuous water cooling so there is no heat-affected zone, combining a clean laser cut with a cool cut.

Question 7

What is the difference between wafer coring and wafer dicing?

Accepted Answer

Coring resizes a wafer into a smaller wafer or custom shape for further processing, while dicing singulates a finished wafer into individual die. Dynamic Process Group offers both services.

Question 8

Where are you located?

Accepted Answer

Dynamic Process Group, Inc. is located at 2033 Gateway Place, Suite 500, San Jose, CA 95110, in Silicon Valley. Call 408-258-5000 or email Info@dynamicprocessgroup.com.