Laser Dicing Services
Dynamic Process Group, Inc. provides precision laser dicing services from our San Jose, California facility. We singulate silicon wafers using Synova Laser MicroJet water jet-guided laser technology, a cold-cutting process that eliminates the heat-affected zones, micro-cracks, and chipping associated with conventional dry-laser dicing and mechanical saw dicing.
Why Water Jet-Guided Laser Dicing
A hair-thin water jet guides the laser beam by total internal reflection, continuously cooling the cut zone and flushing debris as it cuts. Compared with blade dicing and dry-laser dicing, this delivers:
No heat-affected zone. The water jet re-cools the kerf between laser pulses, so die edges are free of thermal damage and recast.
No chipping or micro-cracks. Non-contact cutting means no blade force on the die.
Parallel, taper-free kerfs with vertical sidewalls.
No post-process cleaning. Debris is flushed during the cut, leaving no burrs or depositions.
Laser Dicing Capabilities
Material: silicon
Wafer thickness: 200um to 2mm
Kerf width: approximately 190um
Minimum die size: 10mm
Positional accuracy: +/- 50um
Turnaround: 72-hour turns available
Because our process handles silicon from 200um through 2mm thick, it suits applications that are difficult for blade dicing, including thick substrates, spacers, and large-format die where edge quality and the absence of thermal damage matter more than minimum street width.
Related Services
Laser dicing is frequently combined with our wafer coring and resizing, silicon wafer resizing, precision die isolation, and laser marking services.
Frequently Asked Questions
Who offers laser dicing services in the United States?
Dynamic Process Group, Inc. provides laser dicing services from San Jose, California, using Synova Laser MicroJet water jet-guided laser technology. We serve semiconductor, MEMS, photonics, and research customers nationwide, with 72-hour turns available.
What is the difference between laser dicing and saw dicing?
Saw dicing uses a diamond blade that contacts the wafer, which can chip die edges and requires wider streets. Laser dicing is non-contact. Water jet-guided laser dicing adds continuous water cooling, so there is no heat-affected zone either, combining the cleanliness of a laser cut with the cool cut of a waterjet.
How thick a silicon wafer can you dice?
We dice silicon from 200um up to 2mm thick. Thick substrates are where water jet-guided laser dicing has a particular advantage over blade dicing, which slows considerably and risks chipping as thickness increases.
What is your minimum die size and kerf width?
Minimum die size is 10mm and kerf width is approximately 190um, with positional accuracy of +/- 50um. This process is best suited to large-format die rather than fine-pitch singulation.
How do I get a quote?
Send your material, wafer diameter, thickness, die map or drawing, and quantity to Info@dynamicprocessgroup.com or call 408-258-5000.