What is wafer coring?

Wafer coring is the process of cutting a smaller-diameter wafer from a larger one, or cutting a specific geometry from a wafer. It is used to resize wafers for compatibility with different process tools or research equipment.

What wafer sizes can you core?

Dynamic Process Group cores wafers from 25.4mm (1 inch) up to 450mm (18 inch) in diameter.

What materials can be wafer cored?

We core silicon, SOI (silicon-on-insulator), GaAs, SiC, InP, germanium, sapphire, and other compound semiconductor wafers.

What technology do you use for wafer coring?

We use Synova Laser MicroJet technology, which uses a laser guided by a water jet for cold, clean, precise cuts with no thermal damage, no micro-cracks, and no contamination.

Where are you located?

Dynamic Process Group is located in Silicon Valley, California.

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Dynamic Process Group, Inc.

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Dynamic Process Group, Inc.

Location: Silicon Valley

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