What is wafer coring?

Wafer coring is the process of cutting a smaller-diameter wafer from a larger one, or cutting a specific geometry from a wafer. It is used to resize wafers for compatibility with different process tools or research equipment.

What wafer sizes can you core?

Dynamic Process Group cores wafers from 25.4mm (1 inch) up to 450mm (18 inch) in diameter.

What materials can be wafer cored?

We core silicon, SOI (silicon-on-insulator), GaAs, SiC, InP, germanium, sapphire, and other compound semiconductor wafers.

What technology do you use for wafer coring?

We use Synova Laser MicroJet technology, which uses a laser guided by a water jet for cold, clean, precise cuts with no thermal damage, no micro-cracks, and no contamination.

Where are you located?

Dynamic Process Group is located in Silicon Valley, California.

Laser Wafer Coring Services | Synova Technology | Dynamic Process Group

Laser Wafer Coring Services

Cold, Clean, Precise — Zero Thermal Damage with Synova Laser MicroJet Technology

Dynamic Process Group provides laser wafer coring services using the Synova Laser MicroJet (LMJ) platform. Laser coring is the preferred method for device wafers, SOI substrates, Si-Photonics wafers, and any application where thermal damage, micro-cracks, or surface contamination from mechanical saws would be unacceptable.

How It Works

The Synova LMJ confines a pulsed laser beam inside a thin, laminar water jet using total internal reflection. The water jet simultaneously removes debris and cools the cutting zone, preventing heat from diffusing into surrounding material. Heat-affected zone: effectively zero. Surface roughness: single-digit microns. Kerf width: under 100 microns. No measurable subsurface damage.

Materials We Core

Silicon (Si), Silicon-on-Insulator (SOI), CMOS device wafers, Si-Photonics substrates, Germanium (Ge), Gallium Arsenide (GaAs), Indium Phosphide (InP), Silicon Carbide (SiC), Bonded wafer stacks.

Laser Wafer Coring

Laser Wafer Coring Services

How It Works

Materials We Core

Dynamic Process Group, Inc.

Location: Silicon Valley

Info@waferfab.net