1. Apply HMDS Adhesion Promoter

2. Blanket Coat 5um thick Microchem 220-3 I-Line photoresist

3. Synova MicroJet Laser ablates materials

4. Laser Mark materials maintaining wafer integrity

5. Create new Semi-standard Edge Profile 

6. DI  H20 Rinse wafers

7. EKC strip resist coating

8. DI H20 Rinse ( SRD )

9. Inspection

10. Cleanroom Seal and Package materials into new cassettes