• Home
  • Expertise
  • Process Flow
  • Synova MicroJet
  • Images

Dynamic Process Group, Inc.

  • Home
  • Expertise
  • Process Flow
  • Synova MicroJet
  • Images
200mm SOI into 76.5mm wafers

200mm SOI into 76.5mm wafers

This is the backside image of a 200mm SOI recently cored wafer 725um thick into (4) 76.2mm wafers.

200mm SOI wafer with Photoresist on the Front surface post laser coring.

200mm SOI wafer with Photoresist on the Front surface post laser coring.

125mm silicon holder for 100mm wafer.

125mm silicon holder for 100mm wafer.

1 2 3
200mm SOI into 76.5mm wafers
200mm SOI wafer with Photoresist on the Front surface post laser coring.
125mm silicon holder for 100mm wafer.
Top

Dynamic Process Group, Inc. 

Location: Silicon Valley

Info@waferfab.net