- Laser Coring of SOI wafers
- Laser Resizing of CMOS and Si-Photonics wafers
- Custom Wafer Holders (Pocket Wafers)
- Bonded Wafer Coring
- IP (Intellectual Property) removal
- Precision Die Isolation
- Primary & Secondary Flat modifications (Semi-Standard or Jeida Standard or Custom)
- Hole Drilling
- Laser Marking
- Custom Silicon Spacers
- Custom Silicon Washers
- Custom Dicing Blades (Resin and Sintered materials)
